– BUMPS Technology FOR FLIP CHIP Packaging
– Eutectic Solder layers coated Optical fibers
Production proven Metal BUMPS technology with Metals & Alloy compositions using:
-INDIUM
-COPPER
-GOLD
-LEAD:TIN(Pb:Sn)
-GOLD:TIN(Au:Sn)
-GOLD:GERMANUIM(Au:Ge)
-Eutectic Solder BUMPS deposit endusing Computer controlled co-deposition technology to achieve precise alloy compositions.
